Search
Products
Community
Markets
Brokers
More
EN
Get started
Markets
/
USA
/
HEI
/
Corporate bonds
/
HEI5620574
HEICO Corporation 5.25% 01-AUG-2028
HEI5620574
FINRA
HEI5620574
FINRA
HEI5620574
FINRA
HEI5620574
FINRA
Market closed
Market closed
No trades
See on Supercharts
Overview
Chart
Analysis
News
HEI5620574
chart
1 day
5 days
1 month
6 months
Year to date
1 year
All time
Key terms
Outstanding amount
600.00 M
USD
Face value
1,000.00
USD
Minimum denomination
2,000.00
USD
Coupon
5.25% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
4.37%
Maturity date
Aug 1, 2028
Term to maturity
3 years
About HEICO Corporation 5.25% 01-AUG-2028
Issuer
HEICO Corp.
Sector
Electronic Technology
Industry
Aerospace & Defense
Home page
heico.com
Issue date
Jul 27, 2023
FIGI
BBG01HHNC5G0
Related bonds
See how HEICO Corp. is moving with its highest-yielding bonds.
HEI5620574
analysis
Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.
Start trial
HEI5620574
news